You need to read up on . It covers everything from via-in-pad designs to the nitty-gritty of reflow profiles for high-density interconnects.
Establishes clear thresholds for solder joint voids. Generally, a single void exceeding 25% of the ball diameter requires evaluation, while those over 50% are typically unacceptable. ipc-7095 pdf
In summary, the IPC-7095 PDF serves as an essential resource for professionals involved in the design, manufacturing, and testing of electronic components and assemblies, particularly those working with high-density interconnect packages. Its guidelines and recommendations contribute significantly to the production of high-quality, reliable electronic equipment across various industries. You need to read up on